Comprehensive Engineering Services

Expert hardware design, simulation, and manufacturing tailored to your product goals

Expert Engineering at Every Stage

Our specialized engineers deliver end-to-end support across chip, board, and system-level design

IC Package Design

Extensive experience designing FCCSP/FCBGA/FCLGA Packages. We provide full substrate design flow — from feasibility to tape-out, SI/PI analysis and thermal modeling.
Pre‑design & Co‑design of Substrates
Netlist generation (Excel / OrCAD Capture) & APD layout
BGA Ballmap definition, decoupling & voltage regulator placement
SI/PI study: Sigrity 3DFEM/XTractIM, Ansys HFSS/SIWave
Design guidelines & reference design for BGA products
Flotherm thermal model for substrate
High‑speed interfaces: DDR5, PCIe Gen5, 56G SRDS — largest package: 75x75mm (8‑2‑8 stackup)

PCB / IC Package Layout

Proficient in Allegro PCB Editor, Altium, PADS, OrCAD Layout
System Level Boards, ATE Loadboards, Wafer Probe Cards, Burn‑In Boards, Biased HAST, Die‑N‑Pry, BLR Boards
Very fast turnaround time & spotless Gerber delivery
Work with minimal guidance, full design rule optimization

Hardware Simulation

IC Package & PCB level simulations (pre‑layout & post‑layout)
Proficient with Sigrity and HFSS tools
SI & PI analysis for high-speed interfaces
Thermal analysis using Flotherm model for package/PCB
Eye diagrams, crosstalk, power distribution network optimization

PCB Manufacturing & Assembly

IC Package & PCB level simulations (pre‑layout & post‑layout)
Proficient with Sigrity and HFSS tools
SI & PI analysis for high-speed interfaces
Thermal analysis using Flotherm model for package/PCB
Eye diagrams, crosstalk, power distribution network optimization

Hardware DesignFrom feasibility study, Substrate/IC Package Design, SLT Boards, Quality & Reliability Boards, to Reference Designs, Eval Boards and full board-level products. We partner with you to reduce NRE and overhead.

Chip Level Product Design

Specialized in chip-level design spanning feasibility study, substrate/IC package design, SLT boards, quality & reliability boards, reference designs and eval boards. Ideal for startups to avoid expensive tool/license costs — project‑based support.

Board Level Product Design

Complete product development: idea → MRD/PRD → schematics & layout → simulation (mechanical/thermal) → PCB fabrication & assembly → bringup & validation → final sign-off. Extensive experience in end‑to‑end execution.

Reduced Footprint Product Design

Combine multiple technologies into a smaller form factor — faster time‑to‑market and simplified system design. Real examples: PHY+FPGA inside one package, PHY+ICM compact footprint solution.

Why Choose Us?

We focus on long-term partnerships, helping clients grow their capital with confidence and clarity.

15+ years

Vast experience in international and local markets.

12% average

Annual return across our investment portfolios.

100+ projects

Successful projects with profitable exits.

24/7 support

Transparent terms and top notch support.
Technology Partners