- Extensive experience designing FCCSP/FCBGA/FCLGA Packages.
- Important aspect of Substrate Design includes :
- Pre-design and Co-design of Substrates
- Use excel or orcad Capture for the netlist generation; APD for Layout.
- Define BGA Ballmap : This includes defining BGA Fanout, Decoupling capacitor Placement, Rough Level of Voltage Regulator and high speed interface components placement.
- Provide SI and PI Study for high speed interface and critical Power Rails; using Sigrity 3DFEM/XTractIM or Ansys HFSS/SIWave.
- Provide Design Guidelines and Reference Design for the BGA as a product.
- Provide Industry Standard Flotherm Model for the substrate.
- Proficient with high speed interfaces DDR5, PCIE GEN5, 56G SRDS. Biggest Package designed 8-2-8 with 75mm x 75mm Footprint.
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